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In the semiconductor industry, the pursuit of nanometer-scale process accuracy and extreme chip performance always faces an invisible but critical challenge—thermal runaway. From photolithography to packaging and final testing, the thermal stability of industrial test equipment directly affects process reliability. A mere 0.1°C temperature fluctuation can cause a 2% drop in yield, while a single cooling failure may result in the catastrophic loss of chips worth millions of dollars. For compliance with stringent certifications such as IEC 61508 and ISO 26262, test chambers must maintain near-zero deviation in environmental control. Any lapse in thermal management risks test failure and non-compliance.
To address this challenge, DHT® has developed a high-precision chiller tailored for semiconductor testing, redefining industry benchmarks with three core capabilities: ultra-precise temperature control, interference-free operation, and predictive intelligence. The system complies with UL 61010 and GB/T 2423 safety standards, while its intelligent warning system proactively prevents thermal incidents—becoming the silent sentinel in semiconductor QA protocols.
1.Micron-Level Precision: Why Semiconductor Testing Demands Dedicated Chillers
Semiconductor manufacturing is all about commanding the microscopic world. Take 3D NAND testing as an example: thousands of vertically stacked layers generate extreme localized heat. A cooling delay of even 5 seconds may cause mismatched thermal expansion, leading to structural cracks. Traditional industrial chillers, with ±1°C control accuracy and fluctuating flow rates, struggle to meet three fundamental demands of semiconductor testing:
– Absolute thermal accuracy: To ensure consistent junction temperatures under varying workloads
– Minimal hydraulic disturbance: To avoid pressure interference with sensitive probe stations
– Chemical compatibility: To prevent corrosion in ultra-pure piping systems
The DHT® semiconductor testing chiller is purpose-built for these challenges, engineered around one guiding principle—invisible guardianship of thermal equilibrium during energy exchange.
2.Technology Core: From Thermodynamics to Intelligent Control
Nanometer-Level Precision with PID and Predictive Algorithms
DHT® integrates advanced temperature control algorithms with real-time PID regulation and load-prediction models, achieving ±0.05°C water outlet precision—surpassing SEMI F1-0306 standards. During dynamic thermal events (e.g., chip power surges), a proprietary feedforward compensation algorithm anticipates load fluctuations up to 300 ms in advance, coordinating inverter compressors and electronic expansion valves to suppress thermal overshoot within 0.1°C.
Zero-Disturbance Hydraulics: Aerospace-Grade Damping
By adopting accumulator damping technology from aerospace hydraulics and pairing it with multi-stage centrifugal pumps, DHT® limits pressure fluctuation to ±0.5 kPa—only one-third that of similar systems. This enables seamless integration with sensitive equipment like probe stations and ATE testers, eliminating interruptions caused by hydraulic jitter.
Universal Media Compatibility: Modular Flow Channel Design
Flow circuits utilize a hybrid of 316L low-carbon stainless steel and PEEK polymers, compatible with deionized water, glycol solutions, and fluorinated liquids. DHT®’s proprietary quick-release modular pipeline design enables media changes and full system flushing in under two hours, addressing the corrosion resistance needs of compound semiconductors and silicon photonics.
3.Application-Specific Innovations: Addressing Six Thermal Challenges in Semiconductor Testing
DHT®’s chiller technology evolves in tandem with semiconductor manufacturing needs:
– Wafer-Level Burn-In: Rapid cycling from -40°C to +110°C, enabling 1000 thermal shock tests within 4 hours for 300mm wafers
– High-Density Packaging: Custom dual-loop cooling with up to 120kW capacity, handling thermal flux densities of 200W/cm² for chiplet-based heterogeneous integration
– Photolithography Cooling: Dual-stage thermal control ensures ±0.02°C water stability, maintaining ArF excimer laser wavelength drift under 0.1pm
– Compound Semiconductor Safety: Equipped with hydrogen sensors and nitrogen purging systems to mitigate risks of combustible gases during GaN device testing
– Automotive-Grade Chip Validation: Meets AEC-Q100 with triple protection (salt fog, vibration, and EMI), simulating harsh vehicular environments
– Flexible Lab-Scale Testing: Compact benchtop design (DHC-20M series), ideal for rapid prototyping and batch verification of 5G RF chips
4.Sustainable Cooling for a Net-Zero Semiconductor Future
As the industry races toward maximizing performance-per-watt, DHT® is reshaping thermal systems for sustainability:
– Waste Heat Recovery: Integrated heat pump repurposes excess thermal energy to heat ultrapure water, reducing data center PUE by 0.15
– Free Cooling Utilization: In colder climates, smart switching to air-cooled modes cuts annual energy use by over 30%
– Low-GWP Refrigerants: Ongoing R&D into low-global-warming-potential (GWP) phase-change cooling supports Scope 3 emissions goals for semiconductor clients
Precision Cooling as the Foundation of Process Innovation
Every breakthrough in semiconductor processing is paired with a revolution in thermal control. The DHT® semiconductor chiller—with surgical-grade temperature accuracy, predictive intelligence, and a vision for zero-carbon cooling—is emerging as the silent cornerstone of advanced chip manufacturing. As Moore’s Law approaches its physical limits, the next leap forward may begin with mastery over every single degree of heat.